Card de-bowing mechanism
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United States of America Patent
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Sep 5, 2017
Issued Date -
N/A
app pub date -
Jun 3, 2016
filing date -
May 23, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A substrate de-bowing mechanism, system and method are described. The mechanism can include a substrate support, one or more stationary contact members, and one or more dynamic or movable contact members that are adapted to contact the substrate and bend the substrate in a desired direction to reduce or eliminate bowing of the substrate. The mechanism is controlled by a CPU or other controller that can adjust the de-bow parameters of the de-bowing mechanism based on input settings that can be dynamic and/or static settings. The mechanism can be used to de-bow a variety of substrates including plastic cards, passports, and passport pages.
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