Miniature SMT housing for electronics package
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United States of America Patent
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Aug 29, 2017
Issued Date -
N/A
app pub date -
Jun 3, 2016
filing date -
Jun 19, 2015
priority date (Note) -
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Abstract
A housing, for surface-mount technology (SMT), accepts any electronics package that is mounted on a circular substrate. The housing including the assembled electronics package forms an SMT housing assembly. The SMT housing assembly is placed directly onto the surface of a printed circuit board (PCB). The SMT housing assembly is soldered to the PCB using standard soldering techniques, establishing an electrical connection between the electronics package and the PCB.
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