Elastic wave device and manufacturing method for same
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United States of America Patent
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-
Aug 29, 2017
Issued Date -
N/A
app pub date -
May 23, 2013
filing date -
Nov 30, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An elastic wave device includes a support layer with a through-hole or a recess opened at an upper surface thereof, a piezoelectric thin film arranged on the support layer to extend above the recess or the through-hole of the support layer, and an IDT electrode defined on at least one of upper and lower surfaces of the piezoelectric thin film in a region of the piezoelectric thin film, the region extending above the recess, or the through-hole. A secondary mode of a plate wave, which contains a U1 component as a main component, is utilized. The piezoelectric thin film is made of LiTaO3, and Euler angles (φ, θ, ψ) of the LiTaO3 fall within specific ranges.
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