Light emitting diode module and method of manufacturing the same

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United States of America Patent

PATENT NO 9748458
SERIAL NO

14834690

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Abstract

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A light emitting diode module includes a substrate, a first soldering section, a second soldering section, a block and a light emitting diode die. The substrate has a top surface and includes a circuit structure. The block is formed on the top surface. The soldering section and the second solder section are formed on the top surface of the substrate and electrically connected with the circuit structure. The block is positioned between the first soldering section and the second solder section. A height of the block is larger than thicknesses of the first soldering section and the second soldering section. The light emitting diode die includes a first electrode and a second electrode being respectively electrically connected to the first soldering section and the second soldering section. The block is positioned between the first soldering section and the second soldering section.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED OPTOELECTRONIC TECHNOLOGY INCNO 13 GONGYE 5TH RD HSINCHU INDUSTRIAL PARK HUKOU TOWNSHIP HSINCHU COUNTY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Chien-Shiang Hsinchu, TW 15 12
Hung, Tzu-Chien Hsinchu, TW 73 311

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