Light emitting diode (LED) die module, LED element with the LED die module and method of manufacturing the LED die module
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United States of America Patent
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Aug 29, 2017
Grant Date -
Mar 24, 2016
app pub date -
Jul 27, 2015
filing date -
Sep 19, 2014
priority date (Note) -
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Abstract
A light emitting diode (LED) die module includes an LED die and a guiding layer formed on the LED die. The guiding layer includes a first portion, a second portion and a third portion. The first portion and the second portion are positioned at two edges of the surface of the LED die opposite to each other. The third portion is connected between the first portion and the second portion and divides the surface into a first electrically connecting area and a second electrically connecting area. The first portion, the second portion and the third portion defines a first opening and a second opening. The first opening and the second opening face two opposite directions. The present disclose also provides an LED element with the LED die module and a method of manufacturing the LED die module.
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