Bonded dies with isolation

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United States of America Patent

PATENT NO 9748207
SERIAL NO

15386867

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Abstract

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An electronic circuit structure is formed with first and second dies bonded together. A first active layer is formed in the first die, and a second active layer is formed in the second die. The first and second dies are bonded together, with an isolation capacitor, through which the first and second active layers communicate, disposed between the first and second dies.

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Patent Owner(s)

  • THE SILANNA GROUP PTY LTD

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Krause, Norbert Hawthorne, AU 26 503
Moghe, Yashodhan Vijay Marsfield, AU 17 98

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