System-in-package module with memory
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United States of America Patent
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Aug 29, 2017
Grant Date -
Apr 23, 2015
app pub date -
Oct 23, 2014
filing date -
Oct 23, 2013
priority date (Note) -
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Abstract
A system-in-package module with memory includes a non-memory chip, a substrate, and a memory chip. The non-memory chip has a first portion and a second portion. The substrate has a window and the substrate is electrically connected to the second portion of the non-memory chip. The memory chip is placed into the window of the substrate to electrically connect the first portion of the non-memory chip, and there is no direct metal connection between the memory chip and the substrate.
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