Reflow soldering-compatible integrated RFID barcode label
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United States of America Patent
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Aug 29, 2017
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N/A
app pub date -
Apr 18, 2016
filing date -
Apr 16, 2015
priority date (Note) -
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Abstract
A surface mount technology (SMT)-compatible barcode-printable radio frequency identification (RFID) label that can be attached to a printed circuit board (PCB) work piece for tracking the work piece through an assembly line that includes at least one reflow solder process. The label is constructed from materials and components that function consistently and accurately after being exposed to the high temperature of the reflow solder process, and may further include shielding material to mitigate radio frequency interference. Preferably, the label is configured to be programmed and printed on using an RFID printer.
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