Resin composition for laser direct structuring, resin-molded article, and method for manufacturing molded article with plated layer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Aug 29, 2017
Grant Date -
Jun 12, 2014
app pub date -
Jun 5, 2013
filing date -
Jun 6, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Provided is a resin composition excellent in mechanical strength while maintaining LDS activity. The resin composition for laser direct structuring comprises, relative to 100 parts by weight of a polycarbonate resin component, 10 to 100 parts by weight of a glass filler and 1 to 30 parts by weight of a laser direct structuring additive, wherein the polycarbonate resin component consists of 80 to 30% by weight of a polycarbonate resin and 20 to 70% by weight of a styrene-based resin, or consists of a polycarbonate; and the laser direct structuring additive comprises antimony and tin.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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MITSUBISHI ENGINEERING-PLASTICS CORPORATION | TOKYO |
International Classification(s)
- B41M:PRINTING, DUPLICATING, MARKING, OR COPYING PROCESS....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- H01Q:AERIALS
- B41C:PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF P....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

- 2013 Application Filing Year
- B41M Class
- 377 Applications Filed
- 352 Patents Issued To-Date
- 93.37 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Maruyama, Hiroyoshi | Hiratsuka, JP | 33 | 260 |
# of filed Patents : 33 Total Citations : 260 | |||
Motegi, Atsushi | Hiratsuka, JP | 26 | 21 |
# of filed Patents : 26 Total Citations : 21 |
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Patent Citation Ranking
- 2 Citation Count
- B41M Class
- 32.52 % this patent is cited more than
- 8 Age
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- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Feb 28, 2025 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 28, 2029 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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Legal Events
Date | Code | Event | Description |
---|---|---|---|
Jun 23, 2021 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4 |
Apr 01, 2021 | AS | ASSIGNMENT | free format text: CHANGE OF NAME;ASSIGNOR:FUJI XEROX CO., LTD.;REEL/FRAME:058287/0056 Owner name: FUJIFILM BUSINESS INNOVATION CORP., JAPAN Effective Date: Apr 01, 2021 |
Jan 10, 2018 | PD | Priority Date | |
Jan 09, 2018 | I | Issuance | |
Dec 20, 2017 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Sep 28, 2017 | P | Published | |
Aug 30, 2016 | F | Filing | |
Aug 12, 2016 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TOKUYAMA, ATSUHITO;REEL/FRAME:039588/0092 Owner name: FUJI XEROX CO., LTD., JAPAN Effective Date: Aug 12, 2016 |

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