Resin composition for laser direct structuring, resin-molded article, and method for manufacturing molded article with plated layer

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9745465
APP PUB NO 20140162070A1
SERIAL NO

14129221

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Provided is a resin composition excellent in mechanical strength while maintaining LDS activity. The resin composition for laser direct structuring comprises, relative to 100 parts by weight of a polycarbonate resin component, 10 to 100 parts by weight of a glass filler and 1 to 30 parts by weight of a laser direct structuring additive, wherein the polycarbonate resin component consists of 80 to 30% by weight of a polycarbonate resin and 20 to 70% by weight of a styrene-based resin, or consists of a polycarbonate; and the laser direct structuring additive comprises antimony and tin.

First Claim

See full text

Other Claims data not available

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ENGINEERING-PLASTICS CORPORATIONTOKYO

International Classification(s)

loading....
  • 2013 Application Filing Year
  • B41M Class
  • 377 Applications Filed
  • 352 Patents Issued To-Date
  • 93.37 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201320142015201620172018201920200255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Maruyama, Hiroyoshi Hiratsuka, JP 33 260
Motegi, Atsushi Hiratsuka, JP 26 21

Cited Art Landscape

Load Citation

Patent Citation Ranking

  • 2 Citation Count
  • B41M Class
  • 32.52 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1332551721101 - 1011 - 2021 - 3031 - 40100 +020406080100120140160180200220240260280

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Feb 28, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 Feb 28, 2029