Pain-related compound and medical composition

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United States of America Patent

PATENT NO 9745275
SERIAL NO

15105985

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Abstract

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Provided is a pain-related compound, a pain-related pharmaceutical composition, and use of the same. Provided in one or more embodiments is a compound represented by Formula (I), a prodrug of the same, or a pharmaceutically permissible salt of any of the same.

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Patent Owner(s)

Patent OwnerAddress
KYOTO UNIVERSITYKYOTO-SHI KYOTO 606-8501
KAGOSHIMA UNIVERSITY21-24 KORIMOTO 1-CHOME KAGOSHIMA-SHI KAGOSHIMA 890-8580

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hagiwara, Masatoshi Kyoto, JP 36 151
Hosoya, Takamitsu Tokyo, JP 32 159
Kurihara, Takashi Kagoshima, JP 155 2200
Toyomoto, Masayasu Kyoto, JP 4 0
Yoshida, Suguru Tokyo, JP 71 484

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