Wafer polishing apparatus
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United States of America Patent
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Aug 29, 2017
Grant Date -
Mar 17, 2016
app pub date -
Jul 21, 2015
filing date -
Sep 11, 2014
priority date (Note) -
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Abstract
A wafer polishing apparatus includes a lower surface plate, an upper surface plate disposed over the lower surface plate, a carrier disposed between the lower surface plate and the upper surface plate and containing a wafer, and a lift unit lifting the carrier such that an upper surface of the carrier contacts a lower surface of the upper surface plate or lowering the carrier such that a lower surface of the carrier contacts an upper surface of the lower surface plate.
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