Solder recovery unit
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United States of America Patent
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Aug 29, 2017
Issued Date -
N/A
app pub date -
Dec 1, 2015
filing date -
Sep 11, 2013
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Abstract
A method for recovering solder from solder coated scrap pieces includes a step of containing a quantity of solder coated scrap pieces within a centrifuge receptacle of a first centrifuge. The centrifuge receptacle has perforation holes and is rotatably mounted about a first centrifuge axis. A solder collection container surrounds the centrifuge receptacle. The method further includes the steps of heating the solder coated scrap pieces and melting the solder thereon with a heater surrounding the solder collection container and with a drive system, rotating the centrifuge receptacle while the first centrifuge axis is in about a horizontal position at a low speed and tumbling the scrap pieces along a longitudinal length of the centrifuge receptacle, and later rotating the centrifuge receptacle at a high speed for centrifugally extracting molten solder from the centrifuge receptacle, radially outwardly through the perforation holes into the solder collection container.
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