Method of manufacturing a temperature-compensated micromechanical resonator
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United States of America Patent
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Aug 22, 2017
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May 2, 2013
app pub date -
Oct 31, 2012
filing date -
Oct 31, 2011
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Abstract
A method of making a temperature-compensated resonator is presented. The method comprises the steps of: (a) providing a substrate including a device layer; (b) replacing material from the device layer with material having an opposite temperature coefficient of elasticity (TCE) along a pre-determined region of high strain energy density for the resonator; (c) depositing a capping layer over the replacement material; and (d) etch-releasing the resonator from the substrate. The resonator may be a part of a micro electromechanical system (MEMS).
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