Method and structure for conductive elastomeric pin arrays using solder interconnects and a non-conductive medium
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United States of America Patent
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Aug 22, 2017
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app pub date -
Nov 5, 2014
filing date -
Apr 11, 2014
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Abstract
A method and structure is provided for constructing elastomeric pin arrays using solder interconnects and a non-conductive medium. Pin to pin interconnects are constructed using a solder connection through a non-conductive medium. This structure eliminates the need for PCB structures as the medium, reducing manufacturing cost. In another embodiment one or more elastomeric columns extend through holes or openings in the non conductive medium. The elastomeric columns are fixed securely within the holes preferably with adhesive material. Compression stops are provided on both sides of each elastomeric column for both the upper and bottom surfaces of the non conductive medium.
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