Curable resin composition, optical element and optical semiconductor device
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United States of America Patent
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Aug 22, 2017
Grant Date -
Dec 22, 2016
app pub date -
Jun 15, 2016
filing date -
Jun 16, 2015
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Abstract
Disclosed is a curable resin composition that has significantly high transparency in the UV region, UV resistance and heat resistance, does not cause cracking, peeling or coloration even when used for sealing a UV LED to which high power is applied, and inhibits shrinking during curing. The curable resin composition includes 20-85 wt % of an alkoxy oligomer having a specific structure and present as liquid at room temperature and 15-80 wt % of a silicone resin present as solid at room temperature. The curable resin composition preferably includes 0.1-20 parts by weight of phosphoric acid, as a catalyst, based on 100 parts by weight of the combined weight of the alkoxy oligomer and the silicone resin.
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