Methods, structures, and designs for self-aligning local interconnects used in integrated circuits

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United States of America Patent

PATENT NO 9741719
SERIAL NO

14995483

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Abstract

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An integrated circuit includes a gate electrode level region that includes a plurality of linear-shaped conductive structures. Each of the plurality of linear-shaped conductive structures is defined to extend lengthwise in a first direction. Some of the plurality of linear-shaped conductive structures form one or more gate electrodes of corresponding transistor devices. A local interconnect conductive structure is formed between two of the plurality of linear-shaped conductive structures so as to extend in the first direction along the two of the plurality of linear-shaped conductive structures.

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Patent Owner(s)

  • TELA INNOVATIONS, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Becker, Scott T Scotts Valley, US 250 23870
Smayling, Michael C Fremont, US 250 23378

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