Arrangement in a thermal process, and a method for measuring the thickness of a contamination layer

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United States of America Patent

PATENT NO 9739547
SERIAL NO

14649542

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An arrangement of a thermal device and a surface reflecting and/or scattering electromagnetic radiation in the inner part of the thermal device. A source of electromagnetic radiation is arranged at a first distance (L1) from the surface, and a detector of electromagnetic radiation is arranged at a second distance (L2) from the surface. The source is configured to emit radiation to the surface, which is reflected and/or scattered from the surface as reflected radiation. The detector receives reflected radiation; and the processing unit determines data dependent on the first and/or second distance by the emitted and reflected radiation. A wall of the thermal device has a window or aperture for emitting an optical signal from the light source to the surface. An electromagnetic distance measurement device measures the thickness or the increase in the thickness of a contamination layer from a thermal device.

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Patent Owner(s)

Patent OwnerAddress
VALMET TECHNOLOGIES OYESPOO FINLAND ESPOO SOUTHERN FINLAND

International Classification(s)

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  • 2013 Application Filing Year
  • F23J Class
  • 91 Applications Filed
  • 75 Patents Issued To-Date
  • 82.42 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201320142015201620172018201920200255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Maunula, Joni Tampere, FI 1 0

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Patent Citation Ranking

  • 0 Citation Count
  • F23J Class
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  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1932101 - 1011 - 200246810121416182022242628303234

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