Mold component
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United States of America Patent
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Aug 22, 2017
Issued Date -
N/A
app pub date -
Aug 15, 2014
filing date -
Sep 20, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
There is provided a member of a mold stack (100, 800), the member comprising: a member body (102, 802) defining a member molding surface for defining, in use, a portion of a molding cavity for molding a molded article, a member cooling circuit (120, 820) having a plurality of member cooling channels (128, 829), the plurality of member cooling channels (128, 829) being coupled in parallel to a source of cooling fluid, the member cooling circuit (120, 820) being fully encapsulated within the member body (102, 802).
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