Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies
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United States of America Patent
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Aug 15, 2017
Grant Date -
Feb 20, 2014
app pub date -
Oct 28, 2013
filing date -
Jun 3, 2010
priority date (Note) -
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Abstract
Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies. An embodiment of the invention provides a method of manufacturing a printed circuit including attaching a plurality of metal layer carriers to form a first subassembly including at least one copper foil pad on a first surface, applying an encapsulation material onto the first surface of the first subassembly, curing the encapsulation material and the first subassembly; applying a lamination adhesive to a surface of the cured encapsulation material, forming at least one via in the lamination adhesive and the cured encapsulation material to expose the at least one copper foil pad, attaching a plurality of metal layer carriers to form a second subassembly, and attaching the first subassembly and the second subassembly.
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