Nano-copper via fill for enhanced thermal conductivity of plated through-hole via
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 15, 2017
Issued Date -
N/A
app pub date -
Dec 16, 2014
filing date -
Dec 16, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A process of constructing a filled via of a printed circuit board comprises drilling a via hole through a body of the printed circuit board, desmearing a barrel of the via hole, metallizing a outer surface of the via barrel, electroplating the via barrel, pushing nano-copper solder into the via hole and heating the circuit board in order to melt the nano-copper solder within the via hole. The nano-copper solder improves the thermal conductivity of the printed circuit board for applications when heat needs to be conducted from one side of the printed circuit board to another.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully