Method of manufacturing an electronic component
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United States of America Patent
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Aug 15, 2017
Grant Date -
Jan 30, 2014
app pub date -
Sep 25, 2013
filing date -
Apr 11, 2011
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Abstract
A method for manufacturing an electronic component is provided where resin adhesive rarely spreads before curing. The method includes providing a first sealing member and forming a frame-shaped glass layer on a principal surface of the first sealing member. Moreover, the first sealing member is cut into multiple first sealing members and second sealing members are bonded with resin adhesive to inner frame regions on the principal surface of the first sealing member defined by the glass layer.
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