Reactive conductive pressure-sensitive adhesive tape
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United States of America Patent
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Aug 15, 2017
Grant Date -
Sep 12, 2013
app pub date -
Nov 23, 2011
filing date -
Nov 23, 2010
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Abstract
A reactive pressure sensitive adhesive composition is disclosed. A tape formed using the reactive pressure sensitive adhesive is also disclosed. In its cured state, the pressure sensitive adhesive shows superior mechanical and electrical properties compared to conventional, non-curable charge collection tapes. The tape has a cure profile pre-selected to correspond to that of a photovoltaic cell fabrication process, such that curing can take place during cell fabrication and may occur simultaneously with one or more other curing steps employed in cell fabrication.
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