Optical sensor package and optical sensor assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Aug 15, 2017
Issued Date -
N/A
app pub date -
Dec 4, 2014
filing date -
Dec 4, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
There is provided an optical sensor package including a semiconductor base layer. A first surface of the semiconductor base layer is formed with a pixel array, a plurality of solder balls and an optical component such that when the optical sensor package is assembled with a substrate, the optical component is accommodated in an accommodation throughhole of the substrate so as to reduce the total thickness.
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
PIXART IMAGING (PENANG) SDN BHD | PENANG PULAU |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Chong, Yik-Leong | Penang, MY | 2 | 17 |
# of filed Patents : 2 Total Citations : 17 | |||
Lee, Hun-Kwang | Penang, MY | 7 | 7 |
# of filed Patents : 7 Total Citations : 7 | |||
Lee, Sai-Mun | Penang, MY | 37 | 92 |
# of filed Patents : 37 Total Citations : 92 |
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Patent Citation Ranking
- 2 Citation Count
- H01L Class
- 18.50 % this patent is cited more than
- 8 Age
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