Semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 15, 2017
Grant Date -
N/A
app pub date -
Nov 22, 2016
filing date -
Aug 10, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor package includes a first chip, an insulating protection layer, a second chip, a plurality of second conductive bumps and an underfill. The insulating protection layer is disposed on a first active surface of the first chip and includes a concave. Projections of a plurality of first inner pads and a plurality of first outer pads of the first chip projected on the insulating protection layer are located in the concave and out of the concave, respectively. The second chip is flipped on the concave and includes a plurality of second pads. Each of the first inner pads is electrically connected to the corresponding second pad through the corresponding second conductive bump. The underfill is disposed between the concave and the second chip and covers the second conductive bumps.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2016 Application Filing Year
- H01L Class
- 27971 Applications Filed
- 23507 Patents Issued To-Date
- 84.05 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Feb 15, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 15, 2029 |