Package substrate, method for making the same, and package structure having the same
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United States of America Patent
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Aug 15, 2017
Grant Date -
N/A
app pub date -
Oct 31, 2016
filing date -
Jul 12, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A package substrate includes a first conductive wire layer having a first end portion and a second end portion opposite to the first end portion. A width of the first end portion is greater than that of the second end portion. An isolating layer covers the second end portion and contains the first conductive wire layer. The isolating layer defines blind holes which have conductive portions. A second conductive wire layer covers the isolating layer, and includes a third end portion facing the second end portion and a fourth end portion opposite to the third end portion. A width of the third end portion is greater than that of the fourth end portion. Solder mask layers are formed on the first conductive wire layer and on the second conductive wire layer, each solder mask layer defining an opening.
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