3DIC packaging with hot spot thermal management features

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9735082
APP PUB NO 20150155218A1
SERIAL NO

14096952

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD (TSMC)NO 8 LI-HSIN RD 6 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU 300-77

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Kim Hong Fremont, US 33 1044
Huang, Szu-Po Taichung, TW 36 869
Hung, Wensen Zhubei, TW 87 1277
Jeng, Shin-Puu Hsin-Chu, TW 851 18082
Lee, Hsiang-Fan Hsin-Chu, TW 39 1805
Wu, Chi-Hsi Hsin-Chu, TW 194 3964

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Patent Citation Ranking

  • 6 Citation Count
  • H01L Class
  • 18.50 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges26979357140748325312788503629173801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000950010000

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