3DIC packaging with hot spot thermal management features
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Aug 15, 2017
Grant Date -
Jun 4, 2015
app pub date -
Dec 4, 2013
filing date -
Dec 4, 2013
priority date (Note) -
In Force
status (Latency Note)
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Importance

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Abstract
A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD (TSMC) | NO 8 LI-HSIN RD 6 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU 300-77 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Chen, Kim Hong | Fremont, US | 33 | 1044 |
# of filed Patents : 33 Total Citations : 1044 | |||
Huang, Szu-Po | Taichung, TW | 36 | 869 |
# of filed Patents : 36 Total Citations : 869 | |||
Hung, Wensen | Zhubei, TW | 87 | 1277 |
# of filed Patents : 87 Total Citations : 1277 | |||
Jeng, Shin-Puu | Hsin-Chu, TW | 851 | 18082 |
# of filed Patents : 851 Total Citations : 18082 | |||
Lee, Hsiang-Fan | Hsin-Chu, TW | 39 | 1805 |
# of filed Patents : 39 Total Citations : 1805 | |||
Wu, Chi-Hsi | Hsin-Chu, TW | 194 | 3964 |
# of filed Patents : 194 Total Citations : 3964 |
Cited Art Landscape
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Patent Citation Ranking
- 6 Citation Count
- H01L Class
- 18.50 % this patent is cited more than
- 8 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Feb 15, 2025 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 15, 2029 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
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Aug 19, 2021 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4 |
Mar 27, 2018 | I | Issuance | |
Mar 07, 2018 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Sep 24, 2015 | P | Published | |
Mar 02, 2015 | F | Filing | |
Feb 23, 2015 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TANAKA, YU;REEL/FRAME:035933/0041 Owner name: CANON KABUSHIKI KAISHA, JAPAN Effective Date: Feb 23, 2015 |
Mar 18, 2014 | PD | Priority Date |

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