3DIC packaging with hot spot thermal management features
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United States of America Patent
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Aug 15, 2017
Grant Date -
Jun 4, 2015
app pub date -
Dec 4, 2013
filing date -
Dec 4, 2013
priority date (Note) -
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Abstract
A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.
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