SEMICONDUCTOR DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20170236762A1
SERIAL NO

15419155

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is a semiconductor device that is configured to contain a sealing layer for sealing a semiconductor element supported on a base, the sealing layer being configured to have a nanocomposite structure that comprises a large number of nanometer-sized (1 μm or smaller) insulating nanoparticles composed of SiO2, and an amorphous silica matrix that fills up the space around the insulating nanoparticles without voids and gaps.

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Patent Owner(s)

Patent OwnerAddress
NAPRA CO LTD8-15-17-204 OKUDO KATSUSHIKA-KU TOKYO 124-0022

International Classification(s)

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  • 2017 Application Filing Year
  • H01L Class
  • 30754 Applications Filed
  • 25260 Patents Issued To-Date
  • 82.14 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SEKINE, Shigenobu TOKYO, JP 59 394

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Patent Citation Ranking

  • 1 Citation Count
  • H01L Class
  • 18.50 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges26979357140748325312788503629173801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000950010000

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