Extremely thin package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9735018
SERIAL NO

14834333

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Abstract

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Techniques for achieving extremely thin package structures are disclosed. In some embodiments, a device comprises an integrated circuit connected to a leadframe or substrate via connections and EMC (Epoxy Molding Compound) surrounding the integrated circuit except at a backside of the integrated circuit and connecting areas via which the integrated circuit is connected to the leadframe or substrate.

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Patent Owner(s)

Patent OwnerAddress
RENESAS DESIGN TECHNOLOGY INC2560 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chia Chuan Hsinchu County, TW 2 11
Chin, Lung-Pao Kaohsiung, TW 2 11
Lin, I-Kuo Hsinchu, TW 2 11

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