Plasma processing apparatus

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United States of America Patent

PATENT NO 9734992
SERIAL NO

14365334

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Abstract

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A plasma processing apparatus performs a stable and accurate matching operation with high reproducibility in a power modulation process of modulating of a high frequency power to be supplied into a processing vessel in a pulse shape. In the plasma processing apparatus, an impedance sensor 96A provided in a matching device performs a dual sampling averaging process on a RF voltage measurement value and an electric current measurement value respectively obtained from a RF voltage detector 100A of a voltage sensor system and a RF electric current detector 108A of an electric current sensor system by sampling-average-value calculating circuits 104A and 112A and by moving-average-value calculating circuits 106A and 114A. Thus, an update speed of a load impedance measurement value outputted from the impedance sensor 96A can be matched well with a driving control speed of a motor in a matching controller.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO
DAIHEN CORPORATION1-11 TAGAWA 2-CHOME YODOGAWA-KU OSAKA-SHI OSAKA 532-8512

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hamaishi, Satoru Osaka, JP 5 97
Itadani, Koji Osaka, JP 10 455
Nagami, Koichi Miyagi, JP 50 910
Tachikawa, Toshifumi Miyagi, JP 5 345
Yamada, Norikazu Miyagi, JP 45 1355

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