System and method for defect analysis of a substrate
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United States of America Patent
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Aug 15, 2017
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N/A
app pub date -
Feb 2, 2015
filing date -
Nov 9, 2012
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Abstract
The present disclosure provides a method including providing a first image and a second image. The first image is of a substrate having a defect and the second image is of a reference substrate. A difference between the first image and the second image is determined. A simulation model is used to generate a simulation curve corresponding to the difference and the substrate dispositioned based on the simulation curve. In another embodiment, the scan of a substrate is used to generate a statistical process control chart.
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