Thermocompression bonders, methods of operating thermocompression bonders, and horizontal correction motions using lateral force measurement in thermocompression bonding
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United States of America Patent
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Aug 15, 2017
Grant Date -
Nov 24, 2016
app pub date -
May 17, 2016
filing date -
May 22, 2015
priority date (Note) -
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Abstract
A method of operating a thermocompression bonding system is provided. The method includes the steps of: (a) applying a first level of bond force to a semiconductor element while first conductive structures of the semiconductor element are in contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; (b) measuring a lateral force related to contact between (i) ones of the first conductive structures and (ii) corresponding ones of the second conductive structures; (c) determining a corrective motion to be applied based on the lateral force measured in step (b); and (d) applying the corrective motion determined in step (c).
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