Process monitoring for high-speed joining
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United States of America Patent
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Aug 15, 2017
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app pub date -
Oct 21, 2010
filing date -
Oct 21, 2009
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Abstract
A process monitoring method for a joining operation of a joining element at a speed of at least 5 m/s, in particular placing a bolt at least 10 m/s into at least one component with the aid of a placing device which has the following features: A plunger for placing the joining element, a buffer which limits a maximum deflection of the plunger in the joining direction, and a distance measurement with which the deflection of the plunger can be detected, wherein the process monitoring comprises the following steps: Detecting the travel of the plunger during the joining operation as a function of time in the form of a distance-time curve, detecting a placement of the plunger on the buffer, evaluating the distance-time curve such that, in the presence of at least one maximum followed by at least one minimum in the distance-time curve and without the plunger contacting the buffer, a joint connection is judged to be OK.
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