Plating method
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United States of America Patent
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Aug 8, 2017
Grant Date -
May 1, 2014
app pub date -
May 22, 2012
filing date -
May 27, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board.
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