Ceramic printed circuit board comprising an al cooling body
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United States of America Patent
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Aug 8, 2017
Grant Date -
Jan 16, 2014
app pub date -
Mar 30, 2012
filing date -
Apr 4, 2011
priority date (Note) -
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Abstract
The invention relates to a ceramic printed circuit board comprising an upper side and a lower side, sintered metallization regions being arranged on the upper side, and the lower side being embodied as a cooling body. In order to improve the heat dissipation of components on the upper side of the printed circuit board, the lower side is also provided with sintered metallization regions to which a metal cooling body is soldered.
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