Device member including cavity and method of producing the device member including cavity

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9726563
SERIAL NO

14430321

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A device member including a cavity, includes a base member, an interlayer, an upper layer, an opening portion, and a gas-permeable sealing layer. The base member includes a first semiconductor. The interlayer is formed on the base member and is non-conductive. The upper layer is formed on the interlayer and includes a second semiconductor. The opening portion is formed at the upper layer. The gas-permeable sealing layer is formed to seal the opening portion formed at the upper layer. The cavity is formed by removing the interlayer with an etching gas that penetrates through the sealing layer.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA SAGINOMIYA SEISAKUSHOTOKYO 165-0033
THE UNIVERSITY OF TOKYO3-1 HONGO 7-CHOME BUNKYO-KU TOKYO 113-8654

International Classification(s)

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  • 2013 Application Filing Year
  • H01L Class
  • 22267 Applications Filed
  • 20713 Patents Issued To-Date
  • 93.03 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2013201420152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujita, Hiroyuki Tokyo, JP 290 3516
Mitsuya, Hiroyuki Sayama, JP 23 94
Toshiyoshi, Hiroshi Tokyo, JP 29 169

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Patent Citation Ranking

  • 2 Citation Count
  • H01L Class
  • 18.50 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges26979357140748325312788503629173801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000950010000

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