Device member including cavity and method of producing the device member including cavity
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Aug 8, 2017
Issued Date -
N/A
app pub date -
Jun 18, 2013
filing date -
Sep 25, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A device member including a cavity, includes a base member, an interlayer, an upper layer, an opening portion, and a gas-permeable sealing layer. The base member includes a first semiconductor. The interlayer is formed on the base member and is non-conductive. The upper layer is formed on the interlayer and includes a second semiconductor. The opening portion is formed at the upper layer. The gas-permeable sealing layer is formed to seal the opening portion formed at the upper layer. The cavity is formed by removing the interlayer with an etching gas that penetrates through the sealing layer.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
KABUSHIKI KAISHA SAGINOMIYA SEISAKUSHO | TOKYO 165-0033 | |
THE UNIVERSITY OF TOKYO | 3-1 HONGO 7-CHOME BUNKYO-KU TOKYO 113-8654 |
International Classification(s)

- 2013 Application Filing Year
- H01L Class
- 22267 Applications Filed
- 20713 Patents Issued To-Date
- 93.03 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Fujita, Hiroyuki | Tokyo, JP | 290 | 3516 |
# of filed Patents : 290 Total Citations : 3516 | |||
Mitsuya, Hiroyuki | Sayama, JP | 23 | 94 |
# of filed Patents : 23 Total Citations : 94 | |||
Toshiyoshi, Hiroshi | Tokyo, JP | 29 | 169 |
# of filed Patents : 29 Total Citations : 169 |
Cited Art Landscape
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Patent Citation Ranking
- 2 Citation Count
- H01L Class
- 18.50 % this patent is cited more than
- 8 Age
Forward Cite Landscape
- No Forward Cites to Display

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Fee | Large entity fee | small entity fee | micro entity fee | due date |
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