Microencapsulated curing agent
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 8, 2017
Grant Date -
Jul 17, 2014
app pub date -
Mar 14, 2014
filing date -
Mar 31, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microencapsulated curing agent for use in curing a thermosetting resin is provided. The microencapsulated curing agent includes an organic peroxide curing agent and a polyurethane resin encapsulating the organic peroxide curing agent. The microencapsulated curing agent, when heated to 100° C. for 30 minutes, exhibits a loss of weight of no greater than 10 wt. %. Additionally, when heated to 140° C. for 5 minutes, the microencapsulated curing agent exhibits a loss of weight of at least 4 wt. %.
First Claim
Family
International Classification(s)
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- B01J:CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS, CO....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully