Wafer polishing apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 8, 2017
Grant Date -
Feb 4, 2016
app pub date -
Jun 29, 2015
filing date -
Jul 30, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed is a wafer polishing apparatus including a base, a lower surface plate disposed on the upper surface of the base, an upper surface plate disposed on the lower surface plate and a first shape adjustment unit configured to deform the shape of the lower surface of the upper surface plate so that the lower surface of the upper surface plate has one of a concave shape, a flat shape and a convex shape in a first direction, and the first direction is a direction from the lower surface plate to the upper surface plate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully