Selective solder mask printing on a printed circuit board (PCB)

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United States of America Patent

PATENT NO 9723722
APP PUB NO 20160286659A1
SERIAL NO

15077920

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Abstract

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A method for printing on a substrate, the method may include determining actual locations of substrate holes; printing a first ink on an object at locations that correspond to the actual locations of the substrate holes and curing the first ink to provide a holes mask; and wherein after the substrate is positioned on the object so that holes mask seals bottoms of the substrate holes then printing the second ink on the substrate thereby forming a predefined pattern on the substrate.

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Patent Owner(s)

Patent OwnerAddress
CAMTEK LTDOF RAMAT GAVRIEL IND ZONE P O BOX 544 MIGDAL HA'EMEK 2309407

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ben-Abu, Yehuda Netanya, IL 4 2
Ozeri, Yair Herzliya, IL 3 1

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