Semiconductor package and its manufacturing method
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United States of America Patent
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Aug 1, 2017
Grant Date -
Jun 15, 2017
app pub date -
Nov 30, 2016
filing date -
Dec 11, 2015
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Abstract
Provided is a bonding method to construct a bonding with high thermal reliability between electrodes formed on both chip surfaces of a semiconductor device and wiring. The bonding method includes: bonding a semiconductor chip over a first substrate with a bonding film interposed therebetween; forming a first insulating film over the semiconductor chip; forming a first via in the first insulating film; forming a first wiring over the first insulating film so as to be electrically connected to the semiconductor chip through the first via; forming a second via in the bonding film; and forming a second wiring under the semiconductor chip so as to be electrically connected to the semiconductor chip through the second via.
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