Method for mounting semiconductors provided with bumps on substrate locations of a substrate

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United States of America Patent

PATENT NO 9721819
SERIAL NO

15250796

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Abstract

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The invention relates to a method for mounting semiconductor chips provided with bumps as flip chips on substrate locations of a substrate. The method comprises the placing of a flip chip in a cavity arranged in a stationary manner where the bumps are wetted with a fluxing agent and the position of the flip chip is determined by means of a camera. The method further comprises the use of a transport head and a bonding head, which allow rapid and highly precise mounting.

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Patent Owner(s)

Patent OwnerAddress
BESI SWITZERLAND AGHINTERBERGSTRASSE 32A CHAM 6330

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Speer, Florian Worgl, AT 4 10

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