Apparatus for measuring impurities on wafer and method of measuring impurities on wafer

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United States of America Patent

PATENT NO 9721817
SERIAL NO

15258959

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Abstract

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Provided are an apparatus for measuring impurities on a wafer and a method of measuring impurities on a wafer. The apparatus includes: a wafer aligning device for aligning a wafer; a loading robot for moving and loading the aligned wafer; a rotation stage for rotating the loaded wafer; a scan robot for holding a natural oxide layer etching solution for the wafer and a metallic impurity recovery solution; and a container for receiving a predetermined etching solution and a recovery solution, wherein the scan robot removes an oxide layer on an edge region of the wafer.

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Patent Owner(s)

Patent OwnerAddress
LG SILTRON INCGUMI GYEONGSANBUK-DO 730-350

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Seung Wook Gyeongbuk, KR 94 659

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