Cards and devices with embedded holograms
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United States of America Patent
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Aug 1, 2017
Issued Date -
N/A
app pub date -
Dec 20, 2014
filing date -
Jan 23, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A card, such as a payment card, or other device may include an electronics package. The electronics package may include electronic components mounted on a flexible, printed circuit board. The electronics package may be laminated (e.g., via a hot, cold, or molding lamination process) between layers of transparent polymer. A hologram may be fixed to one side of the electronics package such that the hologram may be viewed from the exterior of the laminated card having transparent polymer layers. As such, the hologram may not be removed without breaching the integrity of a transparent polymer layer.
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