MEMS pressure sensor and method of manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 1, 2017
Grant Date -
Jul 6, 2017
app pub date -
Dec 30, 2015
filing date -
Dec 30, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Calculated Rating
|
US Family Size
|
Non-US Coverage
|
|
Patent Longevity
|
Forward Citations
|
Abstract
A micro-electro mechanical system (MEMS) pressure sensor includes a first substrate, a second substrate and a sensing structure. The second substrate is substantially parallel to the first substrate. The sensing structure is between the first substrate and the second substrate, and bonded to a portion of the first substrate and a portion of the second substrate, in which a first space between the first substrate and the sensing structure is communicated with outside, and a second space between the second substrate and the sensing structure is communicated with or isolated from the outside.
First Claim
Other Claims data not available
Family
+
−
- No Family data available.
International Classification(s)
- 2015 Application Filing Year
- H01L Class
- 25498 Applications Filed
- 22451 Patents Issued To-Date
- 88.06 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Feb 1, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 1, 2029 |
