Electronic device and heat dissipating casing thereof
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United States of America Patent
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Jul 25, 2017
Grant Date -
Mar 24, 2016
app pub date -
Jan 12, 2015
filing date -
Sep 24, 2014
priority date (Note) -
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Abstract
An electronic device includes an electronic component and a heat dissipating casing configured to dissipate heat from the electronic component. The casing includes top and bottom sides of the heat dissipating casing forming a sealed chamber, and a pore structure formed within the sealed chamber. The sealed chamber is configured to receive a working medium and the pore structure is configured to absorb at least a portion of the working medium, whereby the heat generated from the electronic component is dissipated by a phase change of the working medium.
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