Circuit board made of AIN with copper structures
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United States of America Patent
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Jul 25, 2017
Grant Date -
Sep 25, 2014
app pub date -
Oct 31, 2012
filing date -
Nov 3, 2011
priority date (Note) -
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Abstract
Process for producing a ceramic circuit board with electrical conductor traces and contacting points on a side and with a through-hole contact by successively a) producing an AlN substrate and drilling holes at the locations for the vias, b) filling the holes with an adhesive paste containing copper, tungsten and/or molybdenum or alloys thereof, and c) single-pass overprinting with a second adhesive paste using a first screen-printing operation on a side of the ceramic substrate with the layout of the conductor traces and contact points, d) optionally, fully or partially repeating overprinting with the second adhesive paste, e) stoving the printed ceramic substrate in an oven with N2 while controlling oxygen at 0-50 ppm O2, f) overprinting using a second screen-printing process with a low-glass cover paste over the second adhesive paste, and g) stoving the printed ceramic substrate with N2 while keeping the oxygen content at 0-50 ppm O2.
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