Latency compensation network using timing slack sensors
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United States of America Patent
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Jul 25, 2017
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app pub date -
Jun 7, 2016
filing date -
Jun 7, 2016
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Abstract
A latency compensation circuit and method. A three dimensional (3D) package is disclosed having a latency compensation circuit to address timing delays introduced by a through silicon via (TSV), including: an input for receiving a reference data signal from a redundant TSV and for receiving a local clock signal; a timing slack sensor that outputs a digital value reflecting a delay between a clock pulse of the local clock signal and the reference data signal; a look-up table that converts the digital value into a set of control bits; and an adjustable delay line that adjusts the local clock signal based on the set of control bits.
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