Offset leadframe cascode package
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United States of America Patent
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Jul 25, 2017
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N/A
app pub date -
Aug 24, 2016
filing date -
Aug 24, 2016
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Abstract
A composite semiconductor device, such as a high-voltage cascode, is constructed in a single package by mounting a first die on a first planar substrate and second die mounted on a second planar substrate, where the substrates are separated by a gap filled with a dielectric encapsulant. The substrates may be separated both vertically and as well as laterally, to lie in different parallel planes. The substrates are in a leadframe that also includes interconnections, heat sinks, package pins, and removable tie-bars, forming a contiguous metallic structure. Multi-device frames containing multiple leadframes joined by additional tie-bars may be used to process multiple composite semiconductor devices together in, e.g., step-and-repeat wire and die bonding processes and batch encapsulation molding batch processes.
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