Systems and methods for modeling asymmetric vias
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 25, 2017
Grant Date -
N/A
app pub date -
Jul 10, 2015
filing date -
Jul 15, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Systems and methods are provided for analyzing a via. A physical representation of a via intersecting with an upper layer and a lower layer is received, the physical representation comprising: (i) a pair of pad dimensions comprising an upper pad dimension a1 and a lower pad dimension a2, and/or (ii) a pair of anti-pad dimensions comprising an upper anti-pad dimension b1 and a lower anti-pad dimension b2, where at least one of first and second conditions: (A) the first condition being a1 is different than a2, and (B) the second condition being b1 is different than b2, is true. A determination is made as to which, if any, of the conditions are true. At least one model parameter is selected based on the determination. An admittance parameter corresponding to a section of the via located between the upper and lower layers is computed using the selected model parameter.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully