Systems and methods for full-order equivalent circuit approach (ECA) modeling of layered structures
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United States of America Patent
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Jul 25, 2017
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app pub date -
Jul 10, 2015
filing date -
Jul 16, 2014
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Abstract
Systems and methods are provided for generating an equivalent circuit model. RLGC parameters representing a segment of a layered structure of a specified length are received. The layered structure includes two conductors (also called planes) and at least one trace or a transmission line located between the two conductors. An admittance matrix corresponding to the segment is computed based at least in part on the received RLGC parameters. One or more loading parameters representing a loading of one of the two conductors due to the trace or traces are also computed, and a segment circuit model for the segment of the layered structure based at least in part on the admittance matrix and the one or more loading parameters.
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