Resin mold for nanoimprinting and production method thereof
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United States of America Patent
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Jul 25, 2017
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N/A
app pub date -
Aug 3, 2011
filing date -
Aug 6, 2010
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Abstract
A resin mold for nanoimprinting has a substrate, a resin layer formed upon the substrate and having a depressions and protrusions pattern on a surface, an inorganic substance layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the resin layer, and a mold release agent layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the inorganic substance layer. The resin of the resin layer includes constituent units derived from an epoxy group-containing unsaturated compound at a concentration of 1 to 50 percent relative to total constituent units, and the epoxy value is 7.0×10−4 to 4.0×10−2.
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